THERMAL BONDING SYSTEM

Thermal Bonding System 116-P is a system for the purpose of bonding or fusing two polymer components together by applying heat and compression to the components using two heated dies while shielding sensitive components from process heat. The horizontal, retracted orientation of the dies enables process option such as multiple products per cycle (depending on product diameter), pre-tacking the polymer joints at Proximal/Distal sections and pre-shrink the PTFE sleeve without changing tooling.

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System Features

  Heating range 0-750F

PM Plus PID & Integrated Temp Limit Controller – Touchscreen, Bluetooth, Modulus, Ethernet/IP

 System engineering Touch screen interface with custom software
  • Programmable feature for Weld Duration
  • Programmable feature for Cool Duration
  • Start and stop on demand

  Adjustable Die Heads Pressure

  Easily Interchangeable Dies

  Built-in Heatsink with Die Head Bases

  Foot Pedal option to work simultaneously with Start Button

 Custom Device holding Platform with V-groov

Adjustable Z-axis mount for Device Holding Platform Alignment

High-Resolution Digital Microscope Camera with HDMI output