THERMAL REFLOW SYSTEM
Thermal Bonding System with programmable linear stage (Model: 120-P) is a system for the purpose of bonding or fusing two polymer components together by applying heat and compression to the components using two heated dies and/or laminating the polymer(s) up to 20cm Length by precision programmable linear stage. The auto-handling system precisely moves product into the heat zone, traverses at a controlled rate, and or applies compression for a programmed dwell time. The horizontal, retracted orientation of the dies enables process option such as multiple products per cycle (depending on product diameter), pre-tacking the polymer joints at Proximal/Distal sections and pre-shrink the PTFE sleeve without changing tooling.
Heating range 0-750°F
Touch screen interface with custom software
• Programmable target position
• Programmable linear stage speed and dwell time
• Start and stop on demand
Programmable linear stage with precisely move the hot dies through targeted product lamination zone, traverse at controlled rate, and/or applies compression for a programmed dwell time.
PM Plus PID & Integrated temp limit controller – Touchscreen, Bluetooth, Modulus, Ethernet/IP
Built-in heatsink with die head bases
Foot pedal option to work simultaneously with start button
Custom device holding platform with V-groove
Adjustable Z-axis mount for device holding platform alignment
High-Resolution digital microscope camera with HDMI output